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RF and Microwave Microelectronics Packaging -

Anglų
2014-09-05
190,56 € 254,08 €

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechani ... Visas aprašymas

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Daugiau informacijos

Leidėjas Springer New York
Išleidimo metai 2014
Viršelio tipas Minkšti viršeliai
EAN 9781489983244
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190,56 € 254,08 €